Metallized glass substrate and method for manufacturing the same
AssigneesNational Tsing Hua University, Unimicron Technology Corp.
InventorTZU-CHIEN WEI
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Abstract
A metallized glass substrate includes a glass substrate, a heterogeneous bonding layer, and a metal layer. The heterogeneous bonding layer is disposed on the glass substrate. The heterogeneous bonding layer includes a porous structure and a metal catalyst. The porous structure is formed on the glass substrate. A thickness of the porous structure ranges from 210 nm to 350 nm. The metal catalyst is adhered to the porous structure. A microstructure of the heterogeneous bonding layer includes Si—O—Ti bonds. The metal layer is disposed on the heterogeneous bonding layer.
Claims37
A metallized glass substrate, comprising:
- a glass substrate;
- a heterogeneous bonding layer disposed on the glass substrate, and the heterogeneous bonding layer comprising:
- a porous structure formed on the glass substrate, and a thickness of the porous structure ranging from 210 nm to 350 nm;
- and
- a metal catalyst adhering to the porous structure;
- wherein a microstructure of the heterogeneous bonding layer includes Si—O—Ti bonds;
- and
- a metal layer disposed on the heterogeneous bonding layer.
A metallized glass substrate, comprising:
- a glass substrate;
- a heterogeneous bonding layer disposed on the glass substrate, and the heterogeneous bonding layer comprising:
- a porous structure formed on the glass substrate, a material of the porous structure including titanium dioxide, and a thickness of the porous structure ranging from 210 nm to 350 nm;
- and
- a metal catalyst adhering to the porous structure;
- and
- a metal layer partially embedded in the heterogeneous bonding layer.
A method for manufacturing a metallized glass substrate, comprising:
- forming a porous structure on a glass substrate, and a thickness of the porous structure ranging from 210 nm to 350 nm;
- performing an activation process, so as to make a metal catalyst adhere to the porous structure to form a heterogeneous bonding layer, wherein a microstructure of the heterogeneous bonding layer includes Si—O—Ti bonds;
- and
- performing a metallization process, so as to form a metal layer on the heterogeneous bonding layer.
Dependencies are inferred from the claim text.