Radial multi-point solder tip and related solder device
AssigneeVertiv IT Systems, Inc.
InventorsChristopher A. DeJesus, Mark Barnett
Life of this patent
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AssigneeVertiv IT Systems, Inc.
InventorsChristopher A. DeJesus, Mark Barnett
Estimating the term…
In an embodiment, a soldering tip is configured for a number of solder pads at a number of radial locations and includes a soldering head, a shank, and a number of soldering feet. The soldering head is made of a thermally-conductive, corrosion-resistant material. The soldering head defines an upper head surface and a curved forward extension, the curved forward extension descending from the upper surface. The curved forward extension is lengthwise convexly curved and defines an extension face obverse to the upper head surface. The shank is coupled to the upper head surface of the soldering head and is configured to operatively couple with a soldering iron. The shank is made of a thermally conductive material. The soldering feet are operatively coupled to and protrude from the extension face. The soldering feet are configured to transfer bonding energy to the corresponding solder pads.
A soldering tip, comprising:
A soldering unit, comprising:
A soldering tip, comprising:
Dependencies are inferred from the claim text.