Batch alignment device for screen printer and batch alignment method using same

A batch alignment method, wherein a single mask having multiple printing patterns corresponding to the multiple printed circuit boards formed on the printing part of the screen printer is provided at the top such that the solder printing of the multiple printed circuit boards P can be performed in a single printing operation, and the alignment device of the screen printer is provided so that the multiple printed circuit boards are aligned so as to correspond directly to the multiple printing patterns formed on the mask, the batch alignment method comprising:

• a first alignment preparation step (S100) wherein the width of the conveyor frames 560 of the width adjustment conveyor unit 500 is adjusted to correspond to the width of the carrier boat 400 that is formed as a square plate and arranged to be first aligned by the anchoring pins 420 while the multiple printed circuit boards are placed around the through-absorbing parts 410 formed to correspond to the number of channels corresponding to the multiple printed circuit boards P to be printed, as described above;
• a second alignment preparation step (S200) wherein the alignment jig 600 is placed and fixed on the top of the conveyor frames 560 whose width is adjusted to correspond to the width of the carrier boat of the width adjustment conveyor unit 500, and the mask and the alignment jig 600 are matched and aligned;
• a carrier boat-loading step (S300) wherein the carrier boat 400 in which the multiple printed circuit boards P are placed is positioned below the alignment jig, in which the mask and the alignment jig are aligned, through the first alignment preparation step;
• a third alignment preparation step (S400) wherein the vacuum suction part 300 approaches the bottoms of the printed circuit boards placed in the carrier boat to vacuum-absorb by the lifting operation of the cylinder rod 122 of the base panel 100 provided below the carrier boat 400 loaded directly below the alignment jig 600 through the carrier boat-loading step, and the multiple printed circuit boards are simultaneously, batchwise separated to the upper side of the carrier boat;
• a fourth alignment preparation step (S500) wherein the cylinder rod 122 is further operated upward such that the multiple printed circuit boards P, which are separated in batches from the carrier boat by the vacuum suction part through the third alignment preparation step, simultaneously enter the alignment holes 602 of the alignment jig 600, so that the upper surface of the alignment jig 600 and the upper surface of the multiple printed circuit boards P, which entered the alignment holes in batches, are positioned on the same plane;
• a batch alignment step (S600) wherein as the X-axis adjustment panel 230 and the Y-axis adjustment panel 250 of the alignment driving part 200 are finely adjusted, the multiple printed circuit boards P are aligned in batches by adjusting a certain distance along the X-axis and Y-axis lines within the alignment holes 602;
• and a batch alignment finishing step (S700) wherein the multiple printed circuit boards P aligned in batches along the X-axis and Y-axis lines through the batch alignment step are fixed by suction without movement on the same plane as the upper surface of the alignment jig 600 by the vacuum suction part 300 such that solder printing is performed on the multiple printed circuit boards according to the printing pattern formed on the mask.