Smart card
AssigneeDexerials Corporation
InventorRyosuke ODAKA
Life of this patent
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AssigneeDexerials Corporation
InventorRyosuke ODAKA
Estimating the term…
Provided is a smart card that can improve the adhesive strength of the IC chip module even under low pressure, and can prevent deformation of the card by increasing the flowability of the conductive adhesive. The smart card includes a card body 2 with an antenna coil 3 built in, and an IC chip module 4 provided with an antenna connection terminal 5 for conductive connection with the antenna coil 3, the IC chip module 4 being housed in an accommodating recess 6 in the card body 2, wherein the antenna coil 3 and the antenna connection terminal 5 are conductively connected via a conductive adhesive 9 in which conductive particles 8 are blended with binder resin 7, and the antenna connection terminal 5 has an opening 10 with a width larger than the average particle diameter of the conductive particles 8.
A smart card, comprising:
A method for manufacturing a smart card, comprising:
Dependencies are inferred from the claim text.