Wafer-level optics
AssigneeHeptagon Photonics Pte. Ltd.
InventorsBojan TESANOVIC, Nicola SPRING, Sylvain GROSSMANN
Life of this patent
Estimating the term…
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AssigneeHeptagon Photonics Pte. Ltd.
InventorsBojan TESANOVIC, Nicola SPRING, Sylvain GROSSMANN
Estimating the term…
An optical component (200) including: a substrate (202) comprising a through-hole (206) extending from a first opening in a first surface (208a) of the substrate (202) to a second opening in a second surface (208b) of the substrate (202); and a lens element (204) at least partially embedded in the through-hole (206), wherein the substrate (202) is structured to define an aperture stop (212) of the optical component (200) in correspondence of the through-hole (206) to, during an operation of the optical component (200), partially block light and partially allow light to pass through the aperture stop (212), wherein the aperture stop (212) has a lateral dimension in a direction perpendicular to an optical axis of the optical component (200) less than a lateral dimension of a lens portion of the lens element (204) in the direction perpendicular to the optical axis of the optical component (200).
An optical component comprising:
A method of fabricating an optical component, the method comprising:
Dependencies are inferred from the claim text.