Heat-curable resin composition and use thereof

Abstract

Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.

Dependencies are inferred from the claim text.