Package lid adhesion and seal enhancements

Abstract

Semiconductor device packages with lids having features for enhanced adhesion and seal to package frames are described. An example package includes a flange having a top surface, a frame integrated with or secured over the top surface of the flange, and a lid secured over the frame. The lid includes a peripheral detent surface extending along a peripheral side surface of the lid in one example. The lid also includes an interference interlock surface extending around an edge of the peripheral detent surface in other examples. The detent surface, interlock surface, and related features help to position and secure the lid over the frame of the package, providing additional surface areas for contact, mechanical interlock, adhesive grip, and other adhesion and sealing mechanisms. The enhancements result in lids that exhibit enhanced adhesion to and seal with package frames, even after temperature cycling.

Dependencies are inferred from the claim text.