Electronic device with improved reliability
AssigneeSTMicroelectronics International N.V.
InventorsGabriele BELLOCCHI, Simone RASCUNA', Valeria PUGLISI
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Abstract
An electronic device is provided. An example electronic device includes: a semiconductor body of Silicon Carbide, having a surface having a first portion of the surface that defines an active region of the electronic device and a second portion of the surface that is external to the active region; a metallization extending on the first portion of the surface of the semiconductor body; a passivation layer extending on part of the metallization; and an adhesion layer, based on one or more carbon allotropes, extending on the passivation layer.
Claims16
An electronic device comprising:
- a semiconductor body of Silicon Carbide, having a surface having a first portion of the surface that defines an active region of the electronic device and a second portion of the surface that is external to the active region;
- a metallization extending on the first portion of the surface of the semiconductor body;
- a passivation layer extending on part of the metallization;
- and
- an adhesion layer, based on one or more carbon allotropes, extending on the passivation layer.
A process for manufacturing an electronic device comprising:
- forming a semiconductor body of Silicon Carbide, having a surface having a first portion of the surface for defining an active region of the electronic device and a second portion of the surface that is external to the active region;
- forming a metallization on the first portion of the surface of the semiconductor body;
- forming a passivation layer on part of the metallization;
- and
- forming an adhesion layer, based on one or more carbon allotropes, on the passivation layer.
Dependencies are inferred from the claim text.