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US 2026/0040982 A1Published application
Glass package with liquid metal socketing
AssigneeIntel Corporation
InventorsGang Duan, Srinivas Venkata Ramanuja Pietambaram, Jeremy D. Ecton, Brandon Christian Marin, Bohan Shan
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Abstract
A packaging apparatus and methodology for a glass core package that can replace a BGA pinout with a well material perforated with through-holes filled with LM and protected by a thin layer of a dielectric material. The glass package with liquid metal (LM) socketing is to attach to a LM-compatible socket; the LM-compatible socket can be soldered to a main board or printed circuit board (PCB).
Claims20
An apparatus, comprising:
- a package substrate comprising a glass core and an arrangement of conductive pads on a lower surface, wherein the glass core comprises a rectangular prism volume defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area;
- a first insulating material extending across the lower surface of the package substrate;
- a plurality of through-holes formed in the first insulating material in accordance with the arrangement of the conductive pads, and having liquid metal (LM) therein, such that the LM in an individual through-hole is electrically coupled to a respective conductive pad;
- and
- a layer of a second insulating material extending across the first insulating material and across the LM.
2 more elements
A multi-die assembly, comprising:
- a package substrate comprising a glass core, an upper surface, and a lower surface;
- two or more integrated circuit (IC) die attached on the upper surface;
- a ball grid array (BGA) arrangement of conductive pads on the lower surface;
- a plurality of through-glass vias (TGVS) in the glass core, to enable electrical communication from the two or more IC die on the upper surface to the conductive pads on the lower surface;
- a polymer well extending across the lower surface of the package substrate;
- a plurality of through-holes formed in the polymer well, individual through-holes aligned with respective conductive pads, and having gallium therein;
- wherein, the gallium in an individual through-hole is electrically coupled to a respective conductive pad;
- and
- a polyimide layer extending across the polymer well and across the gallium.
6 more elements
A method, comprising:
- depositing a polymer well material on a bottom surface of a glass package component, wherein the glass package component has metal pads arranged in a ball grid array (BGA) pinout;
- forming through-holes in the polymer well material, the through-holes arranged in a one-to-one correspondence with the metal pads in the glass package component;
- filling the through-holes with liquid metal (LM);
- and
- overlaying a protective layer of polyethylene on the polymer well material and the LM.
2 more elements
Dependencies are inferred from the claim text.