Integrated circuit and package with improved fault protection

An integrated circuit (“IC”) chip, comprising:

• an input pin adapted to be configured to receive an input power supply voltage;
• an output pin adapted to be coupled to a load;
• a power switch coupled between the input pin and the output pin;
• a current sense pin adapted to be configured to provide a current sense signal indicative of a current flowing between the input pin and the output pin, and wherein the current sense signal is clamped at a predetermined clamp voltage threshold once the current sense signal reaches the predetermined clamp voltage threshold;
• a fuse-like protection pin adapted to be configured to support a fuse-like protection mode when a capacitive element is coupled to the fuse-like protection pin, and wherein the IC chip is configured to enter into the fuse-like protection mode once a fuse-like protection threshold is triggered;
• and
• a package level fuse protection structure integrated and couped in series with the output pin.