US 2026/0040964 A1 · SEMICONDUCTOR PACKAGE INCLUDING A MOLDED INTERCONNECT

Abstract

A semiconductor package contains a first semiconductor die, electrically coupled to a plurality of leads around a perimeter of the semiconductor package via a molded interconnect. The molded interconnect comprises a plurality of embedded interconnects in a first mold compound which electrically couple the plurality of bond pads of the first semiconductor die to the plurality of leads of the semiconductor package. The molded interconnect may have a greater cross-sectional area at a given pitch compared to a similar wire bonded semiconductor package and allow advantageous thermal management of the semiconductor package compared to other electrical coupling techniques. The molded interconnect may allow small high-power integrated circuits to be packaged with a package footprint which is smaller than would otherwise be available.

Claims20

Dependent claims

A semiconductor package, comprising:

a die pad adjacent to a lead of the semiconductor package;
a first die having a top face and a bottom face, the bottom face of the first die being coupled to the die pad and the top face of the first die having a bond pad;
a molded interconnect having a top face and a bottom face comprising an embedded interconnect in a first mold compound, wherein the embedded interconnect is electrically coupled to the bond pad and the lead;
and
a second mold compound covering portions of the lead, the first die, and the molded interconnect.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor package including a molded interconnect

Life of this patent

Semiconductor package including a molded interconnect

Life of this patent

Abstract

Claims20