Semiconductor device

A semiconductor device comprising:

• two semiconductor elements disposed side by side in an X direction, each of the two semiconductor elements having a plane and a rear plane opposite to each other in a Z direction that is orthogonal to the X direction, and including a collector electrode disposed on the plane and an emitter electrode disposed on the rear plane;
• two heat sinks disposed to sandwich the two semiconductor elements in the Z direction;
• and
• a sealing resin member sealing the two semiconductor elements and the two heat sinks, wherein
• the two heat sinks include a collector-side heat sink connected the collector electrode of each of the two semiconductor elements via a joint material, and an emitter-side heat sink connected to the emitter electrode of each of the two semiconductor elements via the joint material,
• the collector-side heat sink is exposed from one plane of the sealing resin member and the emitter-side heat sink is exposed from a rear plane of the sealing resin member that is opposite to the one plane of the sealing resin member in the Z direction,
• at least one of the two heat sinks is partitioned into two islands,
• the two semiconductor elements are mounted on the two islands, respectively, and
• the two islands are electrically connected to each other.