Method of forming package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Fan CHEN, Chia-Pin CHEN, Wen Chung MA, Chia Sheng TIEN, Yen-Liang CHEN
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Abstract
A method of forming a package structure is provided. The method includes providing a carrier; forming a first conductive layer over the carrier; forming a barrier material layer over a surface the first conductive layer; melting the barrier material layer to allow the barrier material layer to flow from an upper side toward lateral sides of the first conductive layer to form a barrier layer over the first conductive layer and configured to reduce a lateral diffusion of the first conductive layer; and depositing a second conductive layer over the first conductive layer.
Claims20
A method of forming a package structure, comprising:
- providing a carrier;
- forming a first conductive layer over the carrier;
- forming a barrier material layer over a surface the first conductive layer;
- melting the barrier material layer to allow the barrier material layer to flow from an upper side toward lateral sides of the first conductive layer to form a barrier layer over the first conductive layer and configured to reduce a lateral diffusion of the first conductive layer;
- and
- depositing a second conductive layer over the first conductive layer.
A method of forming a package structure, comprising:
- forming a first conductive layer over a carrier;
- forming a barrier material layer over an upper surface and sidewalls of the first conductive layer;
- and
- partially removing the barrier material layer to form a barrier layer on the sidewalls of the first conductive layer without contacting the upper surface of the first conductive layer.
Dependencies are inferred from the claim text.