Semiconductor device assemblies with multi-reticle dies and reticle-bridging conductors

A semiconductor device assembly, comprising:

• a device connection layer including:
• a first surface,
• a first plurality of contact pads at the first surface
• a second surface opposite the first surface,
• a second plurality of contact pads at the second surface,
• a first plurality of conductive structures electrically coupling each of the first plurality of contact pads to a corresponding contact pad of the second plurality of contact pads, and
• a second plurality of conductive structures electrically coupling each of a first subset of the second plurality of contact pads to a corresponding contact pad of a second subset of the second plurality of contact pads;
• and
• a plurality of semiconductor devices carried by the first surface of the device connection layer and electrically coupled to the first plurality of contact pads.

A method of making a semiconductor device assembly, comprising:

• providing a semiconductor device sub-assembly, the semiconductor device sub-assembly including:
• a plurality of first semiconductor devices, and
• a device connection layer formed over the plurality of first semiconductor devices, the device connection layer including a first surface facing the plurality of first semiconductor devices a second surface opposite the first surface and having a second plurality of contact pads, wherein a first subset of the second plurality of contact pads is electrically connected to a second subset of the second plurality of contact pads by a plurality of reticle-bridging conductors;
• and
• bonding a second semiconductor device to the second surface of the device connection layer of the semiconductor device sub-assembly, wherein the second semiconductor device includes a continuous semiconductor substrate having first and second circuit regions separated from one another by a reticle-edge region absent any electrical conductors, such that bonding the second semiconductor device to the semiconductor device sub-assembly electrically couples the first and second circuit regions to each other through the reticle-bridging conductors.