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US 2026/0040920 A1Published application
Semiconductor chip including through electrode, and semiconductor package including the same
AssigneeSK hynix Inc.
InventorsHo Young SON, Sung Kyu KIM, Mi Seon LEE
Life of this patent
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Abstract
A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.
Claims21
A semiconductor chip, comprising:
- a body portion having a front surface and a rear surface;
- a signal through electrode extending through the body portion;
- a plurality of power through electrodes extending through the body portion;
- a signal rear connection electrode disposed over the rear surface of the body portion and electrically connected to the signal through electrode;
- and
- a power rear connection electrode disposed over the rear surface of the body portion and electrically connected to respective ones of the plurality of power through electrodes,
- wherein the power rear connection electrode has a first width, the signal rear connection electrode has a second width, and the first width is greater than the second width.
4 more elements
5-7. (canceled)
A semiconductor package comprising:
- a first semiconductor chip;
- and
- a second semiconductor chip stacked over the first semiconductor chip, and
- the first semiconductor chip comprises:
- a first body portion having a first front surface and a first rear surface;
- a first signal through electrode extending through the first body portion;
- a plurality of first power through electrodes extending through the first body portion;
- a first signal rear connection electrode disposed over the first rear surface of the first body portion and electrically connected to the first signal through electrode;
- and
- a first power rear connection electrode disposed over the first rear surface of the first body portion and electrically connected to the plurality of first power through electrodes,
- the second semiconductor chip comprises:
- a second body portion having a second front surface and a second rear surface;
- a second signal through electrode extending through the second body portion;
- a plurality of second power through electrodes extending through the second body portion;
- a second signal rear connection electrode disposed over the second rear surface of the second body portion and electrically connected to the second signal through electrode;
- and
- a second power rear connection electrode disposed over the second rear surface of the second body portion and electrically connected to the plurality of second power through electrodes,
- wherein the plurality of first power through electrodes are electrically and commonly connected with the plurality of second power through electrodes,
- wherein a width of the first power rear connection electrode is greater than a width of the first signal rear connection electrode, and
- wherein a width of the second power rear connection electrode is greater than a width of the second signal rear connection electrode.
17 more elements
Dependencies are inferred from the claim text.