Method of Increasing a Volume and a Height of a Solder Bump

A solder ball jetting apparatus comprising a capillary, a laser source, a pressurized gas source, and a controller configured to control the capillary, the laser source and the pressurized gas source so as to carry out a method comprising the steps:

• a) placing a solder ball having a predetermined volume in the capillary which is placed over a solder bump present on a contact pad of a substrate,
• b) liquefying the solder ball by applying laser energy from the laser source to the solder ball through the capillary,
• c) ejecting the liquefied solder ball from the capillary onto the solder bump by applying pressurized gas from the pressurized gas source to the liquefied solder ball through the capillary, and
• d) melting the solder bump by transferring thermal and kinetic energy to the solder bump from the ejected liquefied solder ball and merging the liquefied solder ball with the melted solder bump.

A controller for a solder ball jetting apparatus comprising a capillary, a laser source, and a pressurized gas source, wherein the controller is configured to control the capillary, the laser source and the pressurized gas source so as to carry out a method comprising the steps:

• a) placing a solder ball having a predetermined volume in the capillary which is placed over a solder bump present on a contact pad of a substrate,
• b) liquefying the solder ball by applying laser energy from the laser source to the solder ball through the capillary,
• c) ejecting the liquefied solder ball from the capillary onto the solder bump by applying pressurized gas to the liquefied solder ball (2) through the capillary, and
• d) melting the solder bump by transferring thermal and kinetic energy to the solder bump from the ejected liquefied solder ball and merging the liquefied solder ball with the melted solder bump.