Wafer aligner
AssigneeSanwa Engineering Corp.
InventorsChing-Yu Hsiao, Po-Yen Chen
Life of this patent
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AssigneeSanwa Engineering Corp.
InventorsChing-Yu Hsiao, Po-Yen Chen
Estimating the term…
Disclosed is a wafer aligner device including a platform, a lifting gripper disposed on the platform to be lifted up or lowered down relative to the platform, a rotating gripper disposed on the platform to be rotated relative to the platform, a rangefinder disposed next to the platform, and a control module. The control module is electrically connected to the lifting gripper, the rotating gripper, and the rangefinder. The control module drives the lifting gripper to be lifted up or lowered down to transfer a wafer between the lifting gripper and the rotating gripper. When the wafer is disposed on the rotating gripper, the control module rotates the rotating gripper relative to the platform and drives the rangefinder to detect a change in a relative distance along an edge of the wafer so as to determine a position of a notch of the wafer.
A wafer aligner, comprising:
Dependencies are inferred from the claim text.