Substrate polishing apparatus

A substrate polishing apparatus comprising:

• a polishing unit comprising a plurality of polishing modules, the plurality of polishing modules defining a first space and being configured to perform a polishing process on a substrate;
• and
• a cleaning unit comprising a plurality of cleaning modules, the plurality of cleaning modules defining a second space and being configured to perform a cleaning process on the substrate,
• wherein the cleaning unit comprises:
• a plurality of coating modules, the plurality of coating modules defining a third space and being configured to form a coating layer on a front surface of the substrate, and
• a plurality of coating removing modules, the plurality of coating removing modules defining a fourth space and being configured to remove the coating layer formed on the front surface of the substrate, and
• wherein each polishing module of the plurality of polishing modules comprises a polishing pad, the polishing pad being configured to contact a rear surface of the substrate, the rear surface being opposite to the front surface.

A substrate polishing apparatus comprising:

• a polishing unit comprising a plurality of polishing modules, the plurality of polishing modules defining a first space and being configured to perform a polishing process on a substrate;
• a cleaning unit comprising a plurality of cleaning modules, the plurality of cleaning modules defining a second space and being configured to perform a cleaning process on the substrate;
• and
• a standby unit comprising a buffer unit, the buffer unit being positioned between the polishing unit and the cleaning unit in a first horizontal direction and defining a third space that accommodates the substrate,
• wherein the polishing unit comprises a first transfer module located between the buffer unit and the plurality of polishing modules, the first transfer module being configured to provide a movement path for the substrate between the buffer unit and the plurality of polishing modules,
• wherein the standby unit comprises a pair of coating modules, the pair of coating modules defining a fourth space and being configured to form a coating layer on a front surface of the substrate, the pair of coating modules being positioned apart from each other in a second horizontal direction perpendicular to the first horizontal direction,
• wherein the cleaning unit comprises a pair of coating removing modules, the pair of coating removing modules defining a fifth space and being configured to remove the coating layer formed on the front surface of the substrate, the pair of coating removing modules being positioned apart from each other in the second horizontal direction, and
• wherein each polishing module of the plurality of polishing modules comprises a polishing pad, the polishing pad being configured to contact a rear surface of the substrate, the rear surface being opposite to the front surface.