Mother substrate and manufacturing method of mother substrate

A mother substrate, comprising:

• a plurality of panel portions each including a display area and a surrounding area around the display area;
• a margin area around the plurality of panel portions;
• a lower electrode provided in the display area;
• a rib layer provided in the panel portion and the margin area and having a pixel aperture overlapping the lower electrode;
• and
• a first partition provided in the margin area, wherein
• the first partition includes:
• a first bottom layer provided on the rib layer;
• a first stem layer provided on the first bottom layer and having conductivity;
• a first upper portion provided on the first stem layer;
• a first partition aperture;
• a second partition aperture adjacent to the first partition aperture;
• and
• a first portion located between the first partition aperture and the second partition aperture,
• the first bottom layer has a protrusion portion protruding from a side surface of the first stem layer, and
• an upper surface of the first stem layer is exposed in the first portion.

A manufacturing method of a mother substrate, comprising steps of:

• preparing a substrate including a plurality of panel portions each including a display area and a surrounding area around the display area and a margin area around the plurality of panel portions;
• forming a lower electrode in the display area;
• forming a rib layer covering the plurality of panel portions and the margin area;
• forming a first partition in the margin area, the first partition including a first bottom layer formed on the rib layer, a first stem layer formed on the first bottom layer and having conductivity, and a first upper portion formed on the first stem layer;
• making a laser to scan in a second direction inclined with respect to a first direction in which the first partition extends to remove a portion of an overhang portion protruding relative to a side surface of the first stem layer of the upper portion;
• and
• measuring a length of a protrusion portion of the first bottom layer, the protrusion portion protruding relative to the side surface of the first stem layer.

A manufacturing method of a mother substrate, comprising steps of:

• preparing a substrate including a plurality of panel portions each including a display area and a surrounding area around the display area and a margin area around the plurality of panel portions;
• forming a lower electrode in the display area;
• forming a rib layer covering the plurality of panel portions and the margin area;
• forming a first partition in the margin area, the first partition including a first bottom layer formed on the rib layer, a first stem layer formed on the first bottom layer and having conductivity, and a first upper portion formed on the first stem layer;
• forming a resist covering the first partition;
• simultaneously removing with a laser a portion of an overhang portion protruding relative to a side surface of the first stem layer of the first upper portion and a portion overlapping the overhang portion of the resist;
• and
• measuring a length of a protrusion portion of the first bottom layer, the protrusion portion protruding relative to the side surface of the first stem layer.

A manufacturing method of a mother substrate, comprising steps of:

• preparing a substrate including a plurality of panel portions each including a display area and a surrounding area around the display area and a margin area around the plurality of panel portions;
• forming a lower electrode in the display area;
• forming a rib layer covering the plurality of panel portions and the margin area;
• forming a first partition in the margin area, the first partition including a first bottom layer formed on the rib layer, a first stem layer formed on the first bottom layer and having conductivity, a first upper portion formed on the first stem layer, a first partition aperture, and a second partition aperture adjacent to the first partition aperture;
• forming a resist from which at least a portion of the first upper portion is exposed between the first partition aperture and the second partition aperture;
• performing etching to remove the portion exposed from the resist of the first upper portion;
• and
• measuring a length of a protrusion portion of the first bottom layer, the protrusion portion protruding relative to the side surface of the first stem layer.