Display panel, method for manufacturing the same, and display device

A method for manufacturing a display panel, comprising:

• providing a substrate;
• forming a plurality of pixel defining layers on the substrate that are spaced apart from each other, wherein there is defined a pixel opening between every two adjacent pixel defining layers thus obtaining a plurality of pixel openings;
• sequentially forming a conductive layer and an insulating layer on each pixel defining layer, wherein the pixel defining layer, the conductive layer, and the insulating layer jointly form a partition structure;
• forming a light-emitting element within each of the plurality of pixel openings;
• forming a first inorganic encapsulation layer on the plurality of light-emitting elements and the plurality of partition structures;
• forming a first organic encapsulation layer on the first inorganic encapsulation layer between every two adjacent partition structures;
• forming a second organic encapsulation layer on the first organic encapsulation layer;
• etching the corresponding second organic encapsulation layer at a position corresponding to each partition structure, thus defining a third encapsulation groove above the partition structure;
• and
• forming a third organic encapsulation layer within the third encapsulation groove to complete encapsulation of the display panel.

A display device, comprising a display panel, the display panel comprising:

• a substrate;
• a plurality of partition structures, disposed on the substrate and spaced apart from each other, wherein a pixel opening is formed between every two adjacent partition structures, thus obtaining a plurality of pixel openings;
• a plurality of light-emitting elements, disposed within the plurality of pixel openings in one-to-one correspondence;
• a first inorganic encapsulation layer, disposed on and covering a side of the plurality of light-emitting elements and the plurality of partition structures facing away from the substrate;
• a first organic encapsulation layer, disposed between every two adjacent partition structures;
• and
• a second organic encapsulation layer, disposed on a side of the first organic encapsulation layer facing away from the substrate, wherein the first organic encapsulation layer has a viscosity that is lower than a viscosity of the second organic encapsulation layer.