Pick-up control method and transfer device for light-emitting element chip

A pickup control method for a light-emitting element chip, the method comprising:

• a first operation of loading stamps on a transfer head, transporting the transfer head to a first substrate, and picking up light-emitting element chips using the stamps;
• a second operation of transporting the transfer head along with the stamps that were used to pick up the light-emitting element chips to a second substrate, and checking pickup states of the light-emitting element chips transported to the second substrate using an image detector located below the transfer head;
• a third operation of transporting the transfer head along with the stamps that were used to pick up the light-emitting element chips toward a chip removal system when a pickup failure is detected from the light-emitting element chips as a result of analyzing an image captured by the image detector;
• and
• a fourth operation of directing ionized air toward the stamps from the chip removal system, and removing the light-emitting element chips from the stamps in a non-contact manner.