Semiconductor device structure with interposer and method of manufacturing the same
AssigneeNanya Technology Corporation
InventorSHING-YIH SHIH
Life of this patent
Estimating the term…
Abstract
A semiconductor device structure and method of manufacturing the same are provided. The semiconductor device structure includes an interposer and a first electronic component. The interposer includes a first semiconductor die and a second semiconductor die. The first semiconductor die includes a first cache memory and a first memory control circuit. The second semiconductor die includes a second cache memory and a second memory control circuit. The first electronic component is disposed on the interposer and in communication with the first semiconductor die and the second semiconductor die.
Claims14
A semiconductor device structure, comprising:
- an interposer, comprising:
- a first semiconductor die comprising a first cache memory and a first memory control circuit;
- and
- a second semiconductor die comprising a second cache memory and a second memory control circuit;
- and
- a first electronic component disposed on the interposer and in communication with the first semiconductor die and the second semiconductor die;
- wherein the first cache memory is closer to the second memory control circuit than to the second cache memory.
A method of manufacturing a semiconductor device structure, comprising:
- providing a first semiconductor die and a second semiconductor die, wherein the first semiconductor die comprises a first cache memory, and the second semiconductor die comprises a second cache memory;
- forming a first redistribution structure on the first semiconductor die and the second semiconductor die;
- and
- attaching a first electronic component to the first redistribution structure, wherein the first electronic component is in communication with either the first cache memory, the second cache memory, or both by the first redistribution structure.
Dependencies are inferred from the claim text.