High performance redundant liquid cooling for power modules

A power converter system comprising:

• a power converter module assembly including:
• a semiconductor package defining a heat transfer surface;
• a microchannel structure coupled to the heat transfer surface;
• a first flow manifold fluidly coupled to the microchannel structure;
• and
• a second flow manifold fluidly coupled to the microchannel structure in parallel flow arrangement with the first flow manifold;
• a first flow circuit fluidly coupled to the first flow manifold;
• and
• a second flow circuit fluidly coupled to the second flow manifold.

A method comprising:

• providing a first power converter module assembly, the first power converter module assembly comprising:
• a semiconductor package;
• a microchannel structure to the semiconductor package;
• a first flow manifold coupled to the microchannel structure;
• and
• a second flow manifold coupled to the microchannel structure in parallel flow arrangement with the first flow manifold;
• fluidly coupling a first flow circuit to the first flow manifold;
• and
• fluidly coupling a second flow circuit to the second flow manifold.