Multilayer deformable liquid-metal circuits and interconnects with improved reliability

A method, comprising:

• obtaining a substrate comprising, a first plurality of channels and a second plurality of channels;
• forming a plurality of ports;
• and
• filling the first plurality of channels and the second plurality of channels, through at least a subset of the plurality of ports, with an LM, thereby producing a plurality of deformable LM components.

An electronic device, comprising:

• a first plurality of channels and a second plurality of channels;
• a plurality of ports;
• and
• a plurality of deformable LM components formed by filling the first plurality of channels and the second plurality of channels, through at least a subset of the plurality of ports, with an LM material.