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US 2026/0040440 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Hwa PARK, Sang Yun LEE, Sang Ho JEONG, Hyun Hu LEE
Life of this patent
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Abstract
A printed circuit board including: a first conductor pattern; a first insulating film covering at least a portion of the first conductor pattern conforming to a shape of a surface of the first conductor pattern; and an insulating layer disposed on the first insulating film, the first insulating film including a first inorganic layer and a first organic layer.
Claims19
A printed circuit board, comprising:
- a first conductor pattern;
- a first insulating film covering at least a portion of the first conductor pattern and conforming to a shape of a surface of the first conductor pattern;
- and
- an insulating layer disposed on the first insulating film,
- wherein the first insulating film includes a first inorganic layer and a first organic layer.
2 more elements
A printed circuit board, comprising:
- a first insulating layer;
- a first conductor pattern embedded in a first side of the first insulating layer, wherein at least a portion of a first surface of the first conductor pattern is exposed from a first surface of the first insulating layer;
- a first insulating film covering at least a portion of each of a second surface and a side surface of the first conductor pattern and conforming to a shape of the first conductor pattern, and extending onto the first surface of the first insulating layer;
- a second insulating layer disposed on a second surface of the first insulating layer;
- a second insulating film disposed between the first and second insulating layers and having a thickness thinner than each of the first and second insulating layers;
- and
- a second conductor pattern disposed on a first surface of the second insulating layer.
4 more elements
Dependencies are inferred from the claim text.