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US 2026/0040437 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsTakaya KOUCHI, Shusaku SHIBATA, Makiko HIRATA
Life of this patent
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Abstract
A wiring circuit board includes a wiring portion and a first support portion supporting one end portion of the wiring portion. The wiring portion has a metal support layer, a conductive layer, a first insulating layer, and a wiring. A ratio (T1/W1) of a thickness T1 of the metal support layer to a width W1 of the metal support layer is below 1. The conductive layer is disposed on a one-side surface of the metal support layer in a thickness direction of the metal support layer.
Claims7
A wiring circuit board comprising:
- a wiring portion having a wiring extending in a first direction and extending in the first direction, and
- a first support portion supporting one end portion of the wiring portion in the first direction, wherein
- the wiring portion has
- a metal support layer,
- a conductive layer disposed on a one-side surface of the metal support layer in a thickness direction of the metal support layer,
- the wiring disposed at one side of the conductive layer in the thickness direction, and
- an insulating layer disposed between the conductive layer and the wiring in the thickness direction;
- and
- a ratio of a thickness of the metal support layer to a dimension of the metal support layer in a second direction perpendicular to both the thickness direction and the first direction is below 1.
6 more elements
Dependencies are inferred from the claim text.