Electrical Discharge Machining Processing for Semiconductor Workpiece

A method of processing a surface of a semiconductor material, the method comprising:

• obtaining data indicative of a workpiece property;
• determining one or more electrical discharge machining (EDM) system parameters based on the data indicative of the workpiece property;
• and
• removing semiconductor material from the surface using an EDM system based at least in part on the EDM system parameters.

A system for processing a surface of a semiconductor material, the system comprising:

• an electrical discharge machining (EDM) system comprising:
• a tank operable to contain a dielectric fluid and a semiconductor workpiece submerged within the dielectric fluid;
• an electrode head operable to be positioned relative to a surface of the semiconductor workpiece such that a gap is defined between an end of the electrode head and the surface, wherein, when a bias voltage is supplied to the electrode head, an electrical discharge is generated across the gap and a plasma zone is created within the gap that removes material from the surface;
• and
• a translation stage operable to impart relative motion between the electrode head and the surface of the semiconductor workpiece.