Inorganic coating liquid, inorganic coating film, and device having inorganic coating film

Abstract

The present invention provides a method for forming an inorganic coating film, the method including: forming irregularities having a thickness of 0.1 to 1.0 μm on a base material corroded by an acid or a base material having a surface chemically and/or physically changed by an acid, using an inorganic coating liquid containing a copper ion and phosphoric acid and having a pH value of 2.0 to 6.0, in which the inorganic coating film includes copper and phosphorus derived from the copper ion and phosphoric acid. Furthermore, the present invention provides an inorganic coating liquid used in such a method, an inorganic coating film formed by the method, and a device having the inorganic coating film.

Dependencies are inferred from the claim text.