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US 2026/0032877 A1Published application
High-frequency circuit
AssigneeAnritsu Corporation
InventorsYasuki HIRAKAWA, Takato TOKUYAMA, Shunichi KANEOKA, Kohei MIYAKE
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AssigneeAnritsu Corporation
InventorsYasuki HIRAKAWA, Takato TOKUYAMA, Shunichi KANEOKA, Kohei MIYAKE
Estimating the term…
A high-frequency circuit includes a printed circuit board on which a circuit including a plurality of electronic components is disposed, a shield case that is electrically connected to a ground of the printed circuit board and covers the circuit, and at least one spring contact that is electrically connected to the ground in a space formed by the printed circuit board and an inner wall of the shield case, in which the shield case includes a frame that is surface-mounted on the ground and is electrically connected to the ground, and a cover that includes a ceiling surface facing the printed circuit board and is electrically connected to the frame by being in contact with the frame, and the spring contact electrically connects the ground and the cover by being in contact with a part of the ceiling surface.
A high-frequency circuit comprising:
A cavity resonance suppression method in a high-frequency circuit including a printed circuit board on which a circuit including a plurality of electronic components is disposed, and a shield case that is electrically connected to a ground of the printed circuit board and covers the circuit, the shield case including a side wall portion that is surface-mounted on the ground and is electrically connected to the ground, and a lid portion that includes a ceiling surface facing the printed circuit board and is electrically connected to the side wall portion by being in contact with the side wall portion, the method comprising:
Dependencies are inferred from the claim text.