Semiconductor Device and Method of Making a Double-Sided Co-Packaged Optics Module

A method of making a semiconductor device, comprising:

• providing a photonic semiconductor die;
• disposing the photonic semiconductor die on a carrier with a photonic circuit of the photonic semiconductor die oriented toward the carrier;
• depositing an encapsulant over the photonic semiconductor die;
• forming a first build-up interconnect structure over a first surface of the encapsulant;
• and
• forming a second build-up interconnect structure over a second surface of the encapsulant, wherein the photonic circuit is exposed through an opening of the second build-up interconnect structure.

A semiconductor device, comprising:

• a photonic semiconductor die;
• an e-bar disposed adjacent to the photonic semiconductor die;
• an encapsulant deposited over the photonic semiconductor die and e-bar;
• a first build-up interconnect structure formed over a first surface of the encapsulant;
• and
• a second build-up interconnect structure formed over a second surface of the encapsulant, wherein the photonic circuit is exposed through an opening of the second build-up interconnect structure.

A semiconductor device, comprising:

• a photonic semiconductor die;
• an encapsulant deposited over the photonic semiconductor die;
• a first build-up interconnect structure formed over a first surface of the encapsulant;
• and
• a second build-up interconnect structure formed over a second surface of the encapsulant, wherein the photonic circuit is exposed through an opening of the second build-up interconnect structure.