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US 2026/0029436 A1Published application
Power Module
AssigneesHyundai Motor Company, Kia Corporation
InventorsDong Hwan Lee, Suk Hyun Lim, Han Jin Do
Life of this patent
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Abstract
A power module is proposed to provide sensing current through a Hall element. By sensing current through a Hall element, reducing the volume and cost for current sensing can be provided. In addition, by reducing the influence of eddy currents on the Hall element, the sensing accuracy of the Hall element may be improved.
Claims18
A power module comprising:
- a substrate provided with a semiconductor chip and a metal conductive part through which an electric current flows;
- a sensor part installed on the metal conductive part of the substrate and configured to sense the current flowing in the semiconductor chip or the metal conductive part;
- and
- an eddy current reduction pattern part configured to reduce an eddy current around the sensor part by dividing the metal conductive part around the sensor part into a plurality of segments.
1 more element
Dependencies are inferred from the claim text.