Abrasive particles and polishing slurry composition using the same

Abstract

Surface-modified abrasive particles improving the polishing performance of an insulating film and a metal film and having high-temperature stability are provided. An abrasive slurry composition comprising the same is also provided. Such abrasive particles are achieved by adjusting the ratio of the content of the modifier/the content of silica, the ratio of the carbon content in the modifier/the content of silica in the slurry after centrifugation, or the isoelectric point (IEP) difference of the modified abrasive particles in the slurry before and after centrifugation to a specific range during the surface modification of the abrasive particles.

Dependencies are inferred from the claim text.