Method for manufacturing laminate
AssigneeKaneka Corporation
InventorToshihiko Okamoto
Life of this patent
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Abstract
A method for producing a laminate that is obtained by bonding an adherend with a cured product having a high elastic modulus in a high-temperature environment even in a case where low-temperature curing is carried out, is provided. The method for producing a laminate includes the steps of applying a curable resin composition having a specific composition to a first adherend and bonding the first adherend with a second adherend, and subjecting the curable resin composition to low-temperature curing. The laminate has a ratio of a thickness of the cured product and an average thickness of those adherends in a specific range.
Claims14
A method for producing a laminate, comprising the steps of:
- (i) applying a curable resin composition to a first adherend and bonding a second adherend with the first adherend;
- and
- (ii) curing the curable resin composition,
- wherein in the step (ii), the curable resin composition is cured at a temperature of 105° C. to 145° C.,
- in the step (ii), the curable resin composition is cured for 10 minutes to 60 minutes,
- the laminate comprises the first adherend, a cured product obtained by curing the curable resin composition, and the second adherend layered in this order,
- the curable resin composition contains:
- an epoxy resin (A);
- and
- dicyandiamide (B) in an amount of 3.5 parts by mass to 19.0 parts by mass with respect to 100 parts by mass of the epoxy resin (A),
- the epoxy resin (A) contains an unmodified bisphenol A epoxy resin (A-1) in an amount of 51% by mass to 100% by mass in 100% by mass of a total amount of the epoxy resin (A), and
- a thickness (Y) of the cured product and an average thickness (X) of the first adherend and the second adherend is at a ratio (Y/X) of 0.5 to 10.0.
Dependencies are inferred from the claim text.