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US 2026/0028150 A1Published application
Supporting material and packaged article
AssigneeSeiko Epson Corporation
InventorYuta ICHIMIYA
Life of this patent
Estimating the term…
Abstract
In a supporting material having a plate-shaped portion that supports an electronic apparatus, in a packaged state, the plate-shaped portion has holes that receives a plurality of leg portions provided on a bottom surface of the electronic apparatus, and a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.
Claims10
A supporting material comprising a plate-shaped portion that supports an electronic apparatus, in a packaged state, wherein
- the plate-shaped portion has holes that receives a plurality of leg portions provided on a bottom surface of the electronic apparatus, and
- a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.
A packaged article comprising:
- an electronic apparatus having a plurality of leg portions on a bottom surface thereof;
- a supporting material that supports the electronic apparatus, in a packaged state;
- a cushioning material that cushions impact applied to the electronic apparatus;
- and
- a packaging box in which the electronic apparatus, the supporting material, and the cushioning material are housed, wherein
- the supporting material has a plate-shaped portion,
- the plate-shaped portion has holes that receives the plurality of leg portions provided on the bottom surface of the electronic apparatus, and
- a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.
5 more elements
Dependencies are inferred from the claim text.