Processing apparatus and processing method

Abstract

A technology capable of achieving both of reduction of a thermal history and improvement of the reactivity of a processing gas is provided. A processing apparatus according to one embodiment of the present disclosure includes: a processing chamber forming a processing space in which a plurality of substrates are processed; a plasma forming part configured to form a plasma in a plasma formation space communicating with the processing space; a first gas nozzle configured to supply a first processing gas into the processing space; and a second gas nozzle configured to supply a second processing gas into the plasma formation space. The second gas nozzle includes a gas heater configured to heat the second processing gas in the second gas nozzle.

Dependencies are inferred from the claim text.