Flexure mounted pad for chemical mechanical polishing

A chemical mechanical polishing system, comprising:

• a chuck assembly comprising a chuck configured to hold a substrate during a polishing operation;
• a motor configured to rotate the chuck about a first axis;
• and
• a pad carrier assembly including a support that is movable along a radial direction relative to the first axis, a lateral actuator coupled to the support and configured to cause the support to move along the radial direction, a flexure having a first end secured to the support and a second end, a pad carrier/attachment secured to a bottom side of the second end of the flexure and configured to receive and hold a polishing pad, a support arm extending from the support over the flexure such that the support arm and the flexure move together along the radial direction with the second end of the flexure vertically movable relative to the support arm, and a pad carrier actuator secured to the arm and configured to apply a downward pressure to a top of the flexure.