Printed circuit board

Abstract

A printed circuit board including: a conductive pattern including a seed metal layer and a pattern metal layer disposed on the seed metal layer, and the seed metal layer includes a first metal layer including a first metal, and a second metal layer disposed on the first metal layer and connected to the pattern metal layer and including a second metal, the first metal layer has a thickness thicker than the second metal layer, and the first metal is one selected from the group consisting of aluminum (Al), iridium (Ir), molybdenum (Mo), tungsten (W), cobalt (Co), nickel (Ni), and ruthenium (Ru).

Dependencies are inferred from the claim text.