Orthogonal differential vias design on a printed circuit board

An information handling system comprising:

• a printed circuit board including:
• a first differential pair fabricated on the printed circuit board, the first differential pair includes:
• a first via connected to a first signal trace on the printed circuit board;
• and
• a second via connected to a second trace on the printed circuit board;
• a first shielded vertical conductive slot, the first shielded vertical conductive slot includes:
• a third via connected to a third signal trace of a second differential pair on the printed circuit board;
• a fourth via connected to a fourth trace of the second differential pair on the printed circuit board, wherein the third and fourth vias have an orthogonal via pattern;
• and
• a first shield located between the first via and the third and fourth vias;
• and
• a second shielded vertical conductive slot, the second shielded vertical conductive slot includes:
• a fifth via connected to a fifth signal trace of a third differential pair on the printed circuit board;
• a sixth via connected to a sixth trace of the third differential pair on the printed circuit board, wherein the fifth and sixth vias have an orthogonal via pattern;
• and
• a second shield located between the second via and the fifth and sixth vias.

A method comprising:

• fabricating first and second vias in a printed circuit board of an information handling system;
• plating the first via with a first conductive material;
• plating the second via with a second conductive material;
• routing a first trace of a first differential pair to the first conductive material of the first via;
• routing a second trace of the first differential pair to the second conductive material of the second via;
• fabricating a shielded vertical conductive structure in the printed circuit board of the information handling system, wherein the shielded vertical conductive structure includes:
• third and fourth vias and a shield;
• plating the third via with a third conductive material;
• plating the fourth via with a fourth conductive material;
• plating the shield with a fifth conductive material;
• routing a third trace of a second differential pair to the third conductive material of the third via;
• and
• routing a second trace of the second differential pair to the fourth conductive material of the fourth via.