Optical module

An optical module, comprising:

• a lower shell part, the lower shell part comprising a bottom plate and two lower side plates, the two lower side plates being connected to respective opposing sides of the bottom plate;
• a circuit board that is mounted in the lower shell part, two opposite sides of the circuit board respectively contacting the two lower side plates;
• a digital signal processor that is electrically connected to the circuit board through solder balls arranged in a rectangular array, the solder balls comprising ground solder balls and power solder balls;
• wherein the circuit board comprises:
• an upper layer board, wherein a thermally conductive layer is plated on a surface of the upper layer board, the thermally conductive layer contacting the lower side plates, ground solder balls located at an edge of the digital signal processor being connected to the thermally conductive layer;
• and a ground gold finger is provided at one end of the upper layer board, the thermally conductive layer being connected to the ground gold finger;
• a lower layer board that is stacked with the upper layer board;
• and
• at least one thermally conductive plate that is located between the upper layer board and the lower layer board, wherein a side of the at least one thermally conductive plate contacts corresponding lower side plate;
• a fifth thermally conductive via hole is provided between the upper layer board and the at least one thermally conductive plate, two ends of the fifth thermally conductive via hole being respectively connected to the ground solder balls and the at least one thermally conductive plate such that heat from the digital signal processor is conducted through the fifth thermally conductive via hole to the at least one thermally conductive plate;
• and a sixth thermally conductive via hole is provided between the at least one thermally conductive plate and the ground gold finger, two ends of the sixth thermally conductive via hole being respectively connected to the at least one thermally conductive plate and the ground gold finger such that heat from the at least one thermally conductive plate is conducted through the sixth thermally conductive via hole to the ground gold finger.