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US 2026/0018565 A1Published application
Monolithic chip stacking using a die with double-sided interconnect layers
AssigneeIntel Corporation
InventorsAnup PANCHOLI, Kimin JUN
Life of this patent
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Abstract
An apparatus is provided which comprises: a first die having a first surface and a second surface, the first die comprising: a first layer formed on the first surface of the first die, and a second layer formed on the second surface of the first die; a second die coupled to the first layer; and a plurality of structures to couple the apparatus to an external component, wherein the plurality of structures is coupled to the second layer.
Claims20
An apparatus comprising:
- a stack of two or more dies, wherein each die of the stack comprises:
- a first surface;
- a first layer on the first surface, the first layer comprising first interconnects;
- a second surface opposite the first surface;
- and
- a second layer on the second surface, the second layer comprising second interconnects, wherein the second interconnects of a first die in the stack are coupled to the first interconnects of a second die in the stack;
- an additional die coupled to the stack of two or more dies, the additional die comprising:
- a third surface;
- third interconnects coupled to the third surface, wherein the third interconnects are coupled to the second interconnects of one die of the stack of dies;
- and
- a fourth surface opposite the third surface, wherein the fourth surface does not have interconnects;
- and
- a plurality of structures to couple the stack of two or more dies to an external component, wherein the plurality of structures are coupled to the first interconnects of a first die in the stack, and wherein at least one of the stack of two or more dies or the additional die does not include through substrate vias (TSVs).
10 more elements
An apparatus comprising:
- a stack of two or more dies, wherein each die of the stack comprises:
- a first surface;
- a first layer on the first surface, the first layer comprising first interconnects;
- a second surface opposite the first surface;
- and
- a second layer on the second surface, the second layer comprising second interconnects, wherein the second interconnects of a first die in the stack are coupled to the first interconnects of a second die in the stack of dies;
- and
- an additional die coupled to an uppermost die of the stack of two or more dies, the additional die comprising:
- a third surface;
- third interconnects coupled to the third surface, wherein the third interconnects are coupled to the second interconnects of the uppermost die of the stack of dies;
- and
- a fourth surface opposite the third surface, wherein the fourth surface does not have interconnects;
- wherein at least one of the stack of two or more dies or the additional die does not include through substrate vias (TSVs).
10 more elements
An apparatus comprising:
- a stack of dies, wherein each die of the stack of dies comprises:
- first interconnects coupled to a first surface;
- and
- second interconnects coupled to a second surface opposite the first surface, wherein the second interconnects of a first die in the stack are coupled to the first interconnects of a second die in the stack;
- and
- an additional die coupled to an uppermost die of the stack of dies, the additional die comprising:
- third interconnects coupled to a third surface, wherein the third interconnects are coupled to the second interconnects of the uppermost die of the stack of dies by a plurality of solder bonds;
- and
- a fourth surface opposite the third surface, wherein the fourth surface does not have interconnects;
- wherein at least one of the stack of dies or the additional die does not include through substrate vias (TSVs).
7 more elements
Dependencies are inferred from the claim text.