US 2026/0018558 A1 · BONDING APPARATUS AND BONDING METHOD

Abstract

A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a laser interferometer assembly. The laser interferometer assembly includes: a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction; and a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the laser interferometer assembly is further configured to determine coordinate information of the movable pick-up platform.

Claims20

Dependent claims

A bonding apparatus, comprising:

a machine base, comprising a movable pick-up platform;
and
a laser interferometer assembly comprising:
a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction;
and
a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction;
wherein based on the displacement information along the first direction and the displacement information along the second direction, the laser interferometer assembly is further configured to determine coordinate information of the movable pick-up platform.

4 more elements

A bonding method, comprising:

reading a first alignment mark and a second alignment mark on a to-be-bonded first component;
reading a third alignment mark and a fourth alignment mark on a to-be-bonded second component;
determining a calibrated coordinate system based on the first alignment mark and the second alignment mark or based on the third alignment mark and the fourth alignment mark;
determining a fixed coordinate in the calibrated coordinate system;
determining first-direction coordinate information and second-direction coordinate information based on the first alignment mark, the second alignment mark, the third alignment mark, the fourth alignment mark, and the fixed coordinate;
determining a bonding alignment position of the to-be-bonded first component and the to-be-bonded second component based on the first-direction coordinate information and the second-direction coordinate information;
and
bonding the to-be-bonded second component to a predetermined surface position of the to-be-bonded first component.

5 more elements

Dependencies are inferred from the claim text.

Bonding apparatus and bonding method

Life of this patent

Bonding apparatus and bonding method

Life of this patent

Abstract

Claims20