US 2026/0018548 A1 · CONDUCTIVE STRUCTURE WITH MULTIPLE SUPPORT PILLARS

Abstract

Various aspects of the present disclosure generally relate to integrated circuit devices, and to a conductive structure with multiple support pillars. A device includes a die including a contact pad. The device also includes a conductive structure. The conductive structure includes multiple support pillars coupled to the die, a bridge coupled to each of the multiple support pillars, and a cap pillar coupled to the bridge opposite the multiple support pillars. The device further includes a solder cap coupled to the cap pillar. The solder cap is electrically connected to the contact pad via the cap pillar, the bridge, and at least one of the multiple support pillars.

Claims20

Dependent claims

A device comprising:

a die including a contact pad;
a conductive structure including:
multiple support pillars coupled to the die;
a bridge coupled to each of the multiple support pillars;
and
a cap pillar coupled to the bridge opposite the multiple support pillars;
and
a solder cap coupled to the cap pillar, wherein the solder cap is electrically connected to the contact pad via the cap pillar, the bridge, and at least one of the multiple support pillars.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/767,609Filed 9 Jul 2024

Published

15 Jan 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H10W 72/072
Connecting or disconnecting: of bump connectors
H10W 72/30
Interconnections or connectors in packages: die-attach connectors
H10W 72/012
Manufacture or treatment: of bump connectors, dummy bumps or thermal bumps
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Conductive structure with multiple support pillars

Life of this patent

Conductive structure with multiple support pillars

Life of this patent

Abstract

Claims20