Layout scheme for metal-insulator-metal capacitors
AssigneeSkyworks Solutions, Inc.
InventorsPeihua Ye, Thomas Obkircher
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AssigneeSkyworks Solutions, Inc.
InventorsPeihua Ye, Thomas Obkircher
Estimating the term…
Aspects and embodiments disclosed herein include a semiconductor device comprising a metal-insulator-metal capacitor having a capacitance. The metal-insulator-metal capacitor comprises a plurality of metal-insulator-metal capacitors coupled in parallel, each metal-insulator-metal capacitor of the plurality of metal-insulator-metal capacitors having a top plate, a bottom plate, and a corresponding capacitance, and a plurality of bottom contacts, at least one of the plurality of bottom contacts arranged between a pair of directly adjacent metal-insulator-metal capacitors of the plurality of metal-insulator-metal capacitors. Also disclosed are antennaplexers, electronic device modules, and electronic devices including aspects and embodiments of the semiconductor device.
A semiconductor device comprising a metal-insulator-metal capacitor having a capacitance, the metal-insulator-metal capacitor comprising:
An antennaplexer comprising:
A front-end module comprising:
Dependencies are inferred from the claim text.