Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same

An adhesive tape sheet, comprising:

• an adhesive film comprising a non-patterned region and a pattern region having adhesion patterns defined by incision patterns,
• wherein each of the incision patterns defines the adhesion patterns such that at least one side of each of the adhesion patterns is continuous with the non-patterned region and each of the other sides of the adhesion patterns is discontinuous with the non-patterned region, and
• wherein the pattern region comprises:
• a first region in which the adhesion patterns are disposed at a first density;
• and
• a second region in which the adhesion patterns are disposed at a second density different from the first density.

An adhesive tape sheet, comprising:

• an adhesive film comprising a plurality of pattern portions defined by non-patterned portions and incision portions,
• wherein at least a portion of the plurality of pattern portions of the adhesive film comprises:
• an open portion connected to the non-patterned portion in a first direction;
• and
• an extension portion extending from the open portion in a second direction opposite to the first direction and defined by the incision portions, and
• wherein the adhesive film includes an elastic polymer.