Bonding apparatus and bonding method
AssigneeWuhan Xinxin Semiconductor Manufacturing Co., Ltd.
InventorsChao TAO, Junzhou LONG, Li WANG
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Abstract
A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a grating assembly, configured to determine displacement information of the movable pick-up platform along a first direction and displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the grating assembly is further configured to determine coordinate information of the movable pick-up platform.
Claims20
A bonding apparatus, comprising:
- a machine base, comprising a movable pick-up platform;
- and
- a grating assembly, configured to determine displacement information of the movable pick-up platform along a first direction and displacement information of the movable pick-up platform along a second direction;
- wherein based on the displacement information along the first direction and the displacement information along the second direction, the grating assembly is further configured to determine coordinate information of the movable pick-up platform.
A bonding method, comprising:
- reading a first alignment mark and a second alignment mark on a to-be-bonded first component;
- reading a third alignment mark and a fourth alignment mark on a to-be-bonded second component;
- determining a calibrated coordinate system based on the first alignment mark and the second alignment mark or based on the third alignment mark and the fourth alignment mark;
- determining a fixed coordinate in the calibrated coordinate system;
- determining first-direction coordinate information and second-direction coordinate information based on the first alignment mark, the second alignment mark, the third alignment mark, the fourth alignment mark, and the fixed coordinate;
- determining a bonding alignment position of the to-be-bonded first component and the to-be-bonded second component based on the first-direction coordinate information and the second-direction coordinate information;
- and
- bonding the to-be-bonded second component to a predetermined surface position of the to-be-bonded first component.
Dependencies are inferred from the claim text.