Substrate processing system and substrate processing method

A substrate processing method comprising:

• receiving, by a transfer arm, a substrate from a batch processing section in which a plurality of substrates is collectively processed in a state where each of the plurality of substrates stands upright;
• disposing the substrate on a disposing unit including a pin, a first liquid film being formed on an upper surface of the substrate from a process in the batch processing section;
• supplying a pure water toward the upper surface of the substrate, thereby forming a second liquid film of the pure water on the upper surface of the substrate;
• stopping supplying the pure water and maintaining the second liquid film on the upper surface of the substrate for a predetermined time, and
• transporting the substrate to a single wafer processing section in which the plurality of substrates are processed one by one in a horizontal state, in a state where the second liquid film is formed on the upper surface of the substrate.