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US 2026/0016504 A1Published application
Test device
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsHsien-Jui SYU, Po-Wen HSIAO, Wen-Chin LIANG
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Abstract
A test device including a guide plate structure, a shunt structure coupled to the guide plate structure, and a plurality of probes penetrating the guide plate structure and the shunt structure. A side of the guide plate structure is coupled to a circuit board, and another side is coupled to a device under test. The shunt structure has a metal material and thus can provide additional routes for the current, thereby melting caused by excessive current passing through due to abnormality of the probes per se can be prevented.
Claims11
A test device, comprising:
- a guide plate structure;
- a shunt structure coupled to the guide plate structure;
- and
- a plurality of probes penetrating the guide plate structure and the shunt structure, in a manner that the shunt structure contacts with a part of the plurality of probes to provide a current shunting route.
1 more element
Dependencies are inferred from the claim text.