Heat dissipation assembly

A heat sink assembly comprising:

• a. a base plate comprising at least one opening and at least one attachment element for maintaining an electronic component opposite the at least one opening, and
• b. a heat sink independent of the base plate and comprising at least one thermal switch inserted through the at least one opening and arranged to be in thermal contact with the electronic component;
• and
• wherein the heat sink is provided in one piece and comprises at least one relief opposite the thermal switch, the relief being configured to maximize heat exchange with the surrounding atmosphere;
• the thermal switch comprising a contact surface arranged to be in thermal contact with the electronic component and a dissipation plate from which the relief protrudes, the contact surface being attached to the dissipation plate so as to allow the surrounding atmosphere to pass between the dissipation plate and the contact surface.