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US 2026/0015757 A1Published application
Substrate holder, plating apparatus and method for managing substrate holder
AssigneeEbara Corporation
InventorsMasayuki FUJIKI, Kei KITAMURA
Life of this patent
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Abstract
Provided is a technique for appropriately handling a substrate holder depending on a use state of the substrate holder. The substrate holder for holding a substrate that is a plating target in a plating apparatus is suggested. The substrate holder includes an RFID tag, and the RFID tag includes a storage region in which a use attribute is stored, the use attribute including an attribute indicating a state of being used for plating processing.
Claims3
A method for managing a substrate holder for use in a plating apparatus, comprising:
- a step of reading, in the plating apparatus, an RFID tag provided in the substrate holder,
- a step of determining, based on a use attribute stored in the RFID tag, whether or not to perform plating processing of a substrate by use of the substrate holder, and
- a step of updating the use attribute stored in the RFID tag for the substrate holder utilized in the plating processing.
Dependencies are inferred from the claim text.