Compositions for post-cmp cleaning of microelectronic devices

Abstract

The invention provides a composition comprising (a) water, (b) a sulfonated polymer, a sulfonated alkyl amine compound, or a combination thereof, (c) a chelating agent, and (d) an organic compound comprising a quaternary amine, wherein the composition has a pH of less than about 7. The invention also provides a method for removing residue from a surface of a microelectronic device substrate comprising contacting the surface of the microelectronic device substrate with the compositions described herein.

Dependencies are inferred from the claim text.